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Lightweight Low Profile Component Chilisin BTLB001109KXVHBA10 Designed for Modern Electronic Devices

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Lightweight Low Profile Component Chilisin BTLB001109KXVHBA10 Designed for Modern Electronic Devices

Impedance : 50Ω

Insertion Loss : 1dB

Description : 1dB SMD-5P,1.1x0.9mm RF Filters RoHS

Mfr. Part # : BTLB001109KXVHBA10

Model Number : BTLB001109KXVHBA10

Package : SMD-5P,1.1x0.9mm

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Product Overview

The BTLB001109KXVHBA10 is a miniaturized SMD component designed for high-frequency and space-limited applications. It features a compact, low-profile, and lightweight design, making it ideal for modern electronic devices. This component offers low insertion loss and high attenuation, effectively eliminating noise across a wide frequency range. Its high soldering heat resistance ensures compatibility with both flow and re-flow soldering methods. The product is available in tape and reel packaging for efficient automatic mounting.

Product Attributes

Brand: Chilisin
Certifications: RoHS & Halogen Free & REACH Compliance
Packaging: Tape and reel for automatic mounting

Technical Specifications

Part No.	Pass Band	Insertion Loss (at 25)	Insertion Loss (at 105)	Return Loss	Attenuation (50~960 MHz)	Attenuation (1560~1606 MHz)	Attenuation (1710~1990 MHz)	Attenuation (3600 MHz)	Attenuation (4800~5000 MHz)	Attenuation (7200~7500 MHz)	Operating Temperature Range	Power Capacity
BTLB001109KXVHBA10	2400~2500 MHz	1 dB max.	1.2 dB max.	15 dB min.	20 dB min.	30 dB min.	15 dB min.	10 dB min.	35 dB min.	25 dB min.	-40~105C	3W max.

Dimensions

Designation	L	W	T	a	b	c	d	e	f
Dimensions (mm)	1.100.10	0.900.10	0.60 max.	0.250.05	0.180.05	0.250.05	0.750.05	0.950.05	0.3850.05

Mechanical & Environmental Tests

Test Item	Test Condition	Specification
Vibration	10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions	No apparent damage
Drop shock	Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected.	No apparent damage
Soldering heat resistance	Preheating: 15010 (1-2 min). Solder bath: 2605 (101 sec).	Loss of metallization on the edges of each electrode shall not exceed 25%.
Bending test onto printed circuit board	Apply load until bending reaches 2 mm (60 sec holding time).	No apparent damage
Solderability	Solder bath: 2455. Immersion time: 31 seconds. Solder: Sn3Ag0.5Cu.	At least 95% of a surface of each terminal electrode must be covered by fresh solder.
Adhesive strength	Standard for 1109~2016 size	>0.5KgF
Thermal shock	-40~105 for 100 cycles (30 min each cycle).	No apparent damage. Fulfill electrical spec. after test.
Humidity resistance	1052, 80~90% R.H. for 1000 hours.	No apparent damage. Fulfill electrical spec. after test.
High temperature resistance	1052 for 1000 hours.	No apparent damage. Fulfill electrical spec. after test.
Low temperature resistance	-403 for 1000 hours.	No apparent damage. Fulfill electrical spec. after test.

Taping Specifications

SERIES	PCS/Reel	A (mm)	B (mm)	C (mm)	D (mm)	E (mm)	F (mm)
1109	10000	1780.3	600.2	19.30.1	13.50.1	13.60.1	-

Temperature Profile

Parameter	Sn-Pb	Pb-Free
Preheat Tsmin	100	150
Preheat Tsmax	150	200
Average ramp-up rate (Tsmax to TP)	3/second max.	3/second max.
Time main above Temperature (TL)	183 (60~150 seconds)	217 (60~150 seconds)
Peak temperature (TP)	230	250~260
Time within 5 of actual peak temperature (tP)	10 seconds	10 seconds
Ramp-down rate	6/sec max.	6/sec max.
Time 25 to peak temperature	6 minutes max.	8 minutes max.

2410121527_Chilisin-BTLB001109KXVHBA10_C2981215.pdf

Lightweight Low Profile Component Chilisin BTLB001109KXVHBA10 Designed for Modern Electronic Devices Images

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