| Rated Power | 0.5W | |
| Resistance Range | 300 - 2M | |
| Nominal Resistance Tolerance | 20% | |
| Resistance Change Characteristic | B (Linear) | |
| Maximum Operating Voltage | 30VAC | |
| Wiper Noise | 100mV | |
| Zero Position Resistance | R 1K: r01, r03 10
R > 1K: r01, r03 < 1%R | |
| Total Mechanical Travel | 270 10 | |
| Effective Travel | 240 10 | |
| Rotational Torque | 3mNm ~ 30mNm | |
| Detent Strength | 50mNm | |
| Operating Temperature Range | -30 to +85 | |
| Rotary Life Test (No Load) | Resistance change within 10% after 502 cycles | At >90% of effective angle, 1 cycle/6 seconds |
| Temperature Characteristic (No Load) | Resistance change within 3% | After 5 hours at 703 |
| Thermal Cycling (No Load) | Resistance change within 3% | After 5 cycles of -30 (30min) -> Room Temp/Humidity (15min) -> 85 (30min) -> Room Temp/Humidity (15min), followed by 2 hours at room temp/humidity |
| Long-Term Heat Resistance (No Load) | Resistance change within 5% | After 50010 hours at 703, followed by 2 hours at room temp/humidity |
| Damp Heat Resistance (No Load) | Resistance change within 5% | After 50010 hours at 402, 90-95% humidity, followed by 5 hours at room temp/humidity |
| Load Life Test | Resistance change within 5% | After 50010 hours of cycle at 402, 90-95% humidity with rated voltage applied for 1.5 hours, then cut for 0.5 hours, followed by 5 hours at room temp/humidity |
| Solder Heat Resistance | Resistance change within 2% | After immersion in solder bath at 26010 for 30.5 seconds, followed by 1 hour at room temp/humidity |
| Temperature Coefficient | Within 250PPM/ | During placement at 25 (30min) -> -30 (30min) -> 25 (30min) -> 85 (30min) |
| Soldering Condition | Temperature: 26010
Time: Within 3 seconds (total time) | |
