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Electronic Noise Filter Microgate MGRC2012M900T-2-LF Common Mode Choke Coil for Circuit Protection

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Electronic Noise Filter Microgate MGRC2012M900T-2-LF Common Mode Choke Coil for Circuit Protection

Insulation Resistance(IR) : 10MΩ

Operating Temperature : -25℃~+85℃

DC Resistance(DCR) : 300mΩ

Voltage Rating - DC : 50V

Number of Lines : 2

Description : 2Line Common Mode Choke Surface Mount-4P 2x1.2mm 90Ω@100MHz 370mA DCR 300mΩ

Mfr. Part # : MGRC2012M900T-2-LF

Model Number : MGRC2012M900T-2-LF

Package : SMD-4P,2x1.2mm

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Product Overview

The MGRC series of Common Mode Choke Coils are designed for effective noise suppression. These components are manufactured by Shenzhen Microgate Technology Co., Ltd. and are suitable for various electronic applications requiring reliable performance and signal integrity.

Product Attributes

Brand: MICROGATE
Series Name: MGRC
Origin: Shenzhen, P.R.C.
Material: Ni-Zn Ferrite Core, Copper Wire (P180-G1, 0.045mm)
Environmental Compliance: Lead Free

Technical Specifications

Part No.	Series Name	Dimensions (LW mm)	Common Mode Impedance () /100MHz	IR (mA) /max	RDC() /max	Rated Voltage(V) /max	Operating Temperature Range	Material Code	Packing Style	Number of Signal Lines
MGRC2012M900T-2-LF	MGRC	2.0 1.2	90 25%	370	0.30	50	-25 to +85	M900	T (Taping)	2

Reliability Testing

Item	Specifications	Test Methods	Conditions
Solder- Ability	Can be connected on the Recommendation soldering condition.	Solder: 96.5Sn/3.5 Ag, Temperature: 2555, Flux: rosin, Duration: 3.50.5s	-
Leaching Resistance	More than 75% of termination Should be covered with new solder.	Solder: 96.5Sn/3.5 Ag, Temperature: 2702, Flux: rosin, Duration: 100.5s	-
Terminal Strength	The terminal and body should be no damage.	Apply a lateral load of 7.5N in the arrow direction.	-
Bending Strength	No mechanical damage should be noticed.	When the board curves to 2mm (0.079 inches).	-
Vibration	1. No mechanical damage. 2. Impedance within 20% of initial value. 3. Insulation resistance: >10 M DC.	Frequency: 10 to 55Hz, Amplitude: 1.52mm, Directions: X, Y, Z for 2 hours each.	-
Humidity resistance	-	-	Temperature: 852, Humidity: 90%~95%, Test time: 50012 h. Stabilize for (242) hours after test.
High temperature resistance	-	Applied rated current.	Temperature: 852, Test time: 5012 h. Stabilize for (242) hours after test.
Low temperature resistance	-	-	Temperature: -252, Test time: 4812 h. Stabilize for (242) hours after test.
Thermal shock (Temperature cycle)	-	-	-25 for 303min, +85 for 303min, 5 cycles. Stabilize for (242) hours after test.

Recommended Soldering Conditions

Recommended Footprint

(Diagram not provided in source text)

Recommended Reflow Soldering Conditions (Lead-Free Assembly)

Profile Feature	Specification
Average Ramp-Up Rate (Tsmax to Tp)	3/second max.
Preheat Temperature Min (Tsmin)	150
Preheat Temperature Max (Tsmax)	200
Preheat Time (tsmin to tsmax)	60-180 seconds
Time maintained above: Temperature (TL)	217
Time maintained above: Time (tL)	60-150 seconds
Peak/Classification Temperature (Tp)	255
Peak/Classification Time (Tp)	3-4 seconds
Time within 5 C of actual Peak Temperature (tp)	20-40 seconds
Ramp-Down Rate	6C/second max.
Time 25 C to Peak Temperature	8 minutes max.
Note 1: All temperatures refer to topside of the package, measured on the package body surface.

Reworking with Soldering Iron

Condition	Specification
Pre-heating	150, 1 minute
Tip temperature	260 max
Soldering iron output	30w max
End of soldering iron tip size	1mm max
Soldering time	5 seconds max

Packaging

Tape Dimensions

(Diagram not provided in source text)

Reel Dimensions

Dimension	Size (mm)
A	180
B	60
C	13
D	14.4
E	8.4

Taping Strength

Component	Strength
Carrier tape	10N or more (1kgf or more)
Cover tape	5N or more (1kgf or more)

Peeling Strength of Cover Tape

0.05~0.69N

Packing Quantity

T type: 2000pcs/reel (180 mm reel)

Tape Material

Base tape: Polystyrene
Cover tape: Polyester

Taping Figure and Drawing Direction

(Diagram not provided in source text)

Test Conditions for Taping Strength

Temperature: 5~35
Humidity: 45~85%
Atmospheric pressure: 860~1060 hpa.

2409271432_microgate-MGRC2012M900T-2-LF_C20606769.pdf

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