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Noise Filter Microgate MGCC1210M900T-2-LF with Ferrite Base Material and Lead Free Terminal Electrodes

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Noise Filter Microgate MGCC1210M900T-2-LF with Ferrite Base Material and Lead Free Terminal Electrodes

Operating Temperature : -40℃~+85℃

DC Resistance(DCR) : 4Ω

Voltage Rating - DC : 5V

Number of Lines : 2

Description : 4Ω 2 SMD Common Mode Chokes RoHS

Mfr. Part # : MGCC1210M900T-2-LF

Model Number : MGCC1210M900T-2-LF

Package : SMD

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Product Overview

The MGCC series of Common Mode Filters from Shenzhen Microgate Technology Co., Ltd. are designed for effective noise suppression. These filters, particularly the MGCC1210M900T-2-LF model, are constructed with a ferrite base material and feature silver internal conductors and terminal electrodes, plated with nickel and tin. They are suitable for applications requiring reliable EMI/RFI filtering, operating within a wide temperature range of -40 to +85C.

Product Attributes

Brand: MICROGATE
Origin: Shenzhen, China
Product Series: MGCC
Material: Ferrite (Base Material), Silver (Internal Conductor, Terminal Electrode), Nickel (Terminal Electrode), Tin (Terminal Electrode)
Environmental Compliance: Lead Free (LF)
Polarity: No polarity

Technical Specifications

Part Number	Series Name	Dimensions (LW)	Impedance at 100MHz	Differential Mode Impedance at 100MHz (max.)	Rated Voltage (V DC)	Rated Current (mA DC)	DC Resistance ( max.)	Operating Temperature Range	Storage Temperature Range
MGCC1210M900T-2-LF	MGCC	1.251.00 mm [0504]	90 (25%)	15	5V	160mA	1.75	-40 to +85C	-40 to +125C

Dimensions (mm)

Type	A	B	C	D	E	F
1210 [0504]	1.250.15	1.000.15	0.50.1	0.200.15	0.550.10	0.30.1

Reliability Testing Specifications

Item	Specifications
Solder-Ability	More than 90% of termination should be covered with new solder.
Resistance to Soldering Heat	Impedance variation: within 30 %; Remaining terminal: 70 % min.
Bending Strength	No abnormality of appearance; Impedance variation: within 30 %.
Vibration	No abnormality of appearance; Impedance variation: within 30 %.
Heat Cycle	No abnormality of appearance; Impedance variation: within 30 %.
Load Life	No abnormality of appearance; Impedance variation: within 30 %.
Humidity	No abnormality of appearance; Impedance variation: within 30 %.
Humidity Load Life	No abnormality of appearance; Impedance variation: within 30 %.

Recommended Soldering Conditions (Reflow Soldering)

Parameter	SnAgCu lead-free (Sn-3Ag-0.5Cu)
Preheating Temp.	150 to 170C
Preheating Time	30 to 60 S
Rising temp. 1	Preheating to 210C
Main heating	250+10/-5C
Rising temp. 2	210 to 100C
Cooling	Gradual cooling
Time (above 200 C)	20 to 40 S

Packaging

Packaging Style: Taping (T)
Quantity per Reel: 5,000 PCS/Reel
Cover Tape Peeling Strength: 0.3~1.3N (at 165~180 peel angle, 300mm/min 10% peel speed)

Storage Conditions

Storage Period: Use within six months from MICROGATE inspection date. Check solderability if exceeded.
Temperature: 40
Humidity: 70% relative humidity
Other: Store in a warehouse without rapid temperature/humidity changes, corrosive substances, heat shock, vibration, or direct sunlight. Keep in airtight packaging.

2507221720_microgate-MGCC1210M900T-2-LF_C49274405.pdf

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