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Voltage Rating : 1kV
Capacitance : 1nF
Body Thickness : 2.5mm
Temperature Coefficient : Y5P
Tolerance : ±10%
Pin Spacing : 5mm
Description : 1nF ±10% 1kV Ceramic Capacitor Through Hole P=5mm
Mfr. Part # : H102K050BN48230L502
Model Number : H102K050BN48230L502
Package : Through Hole,P=5mm
The Dafu Manufacturing Ceramic Capacitors are designed for reliable performance in a wide range of electronic applications. These components are primarily utilized in power circuits and output circuits of various electronic devices, including air conditioners, color televisions, monitors, photocopiers, switching power supplies, energy-saving lamps, telephones, audio equipment, and tape recorders. They offer stable electrical characteristics and mechanical durability.
Product Name: Ceramic Capacitor ()
Model Series: Y5P
Voltage Rating: 1KV
Lead Type: Long Lead ()
Date of Approval: 2020-11-04
| Customer Part No. | Product Code | Dimensions (mm) D1.0 | Dimensions (mm) T1.0 | Dimensions (mm) L1.0 | Dimensions (mm) F0.5 | Lead Diameter (d0.05) | Lead Spacing (e Max) | Capacitance (CAP) (PF) | Dissipation Factor (DF) (%) | Insulation Resistance (IR) (M) | Test Voltage (T.V) (V) | Lead Style |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| H101K050BN48230L | 502 | 5.5 | 2.5 | 23 | 5.0 | 0.48 | 3.5 | 100 | 2.5 | 10000 | 1000 | L |
| H102K050BN48230L | 502 | 5.5 | 2.5 | 23 | 5.0 | 0.48 | 3.5 | 1000 | 2.5 | 10000 | 1000 | L |
| H471K050BN48230L | 502 | 5.0 | 2.5 | 23 | 5.0 | 0.48 | 3.5 | 470 | 2.5 | 10000 | 1000 | L |
| H222K070BN48230L | 502 | 7.5 | 2.5 | 23 | 5.0 | 0.48 | 3.5 | 2200 | 2.5 | 10000 | 1000 | L |
| Item Name | Test Method | Technical Requirements |
|---|---|---|
| Capacitance and Tolerance | Tested at 25, 1 MHz and 1 Vrms (Class ), 1 kHz and 1 Vrms (Class ), 1 kHz and 0.1 Vrms (Class ) | Refer to specification table |
| Quality Factor (Q) or Dissipation Factor (DF) | Same test conditions as above | Y5P: 2.5% max. |
| Insulation Resistance (IR) | Tested under rated voltage or 500VDC (above rated voltage), charged for 605 seconds | Class , : 10000M min.; Class : 250M min. |
| Dielectric Strength | Voltage between leads: 300% rated voltage (50V~500V), 150% rated voltage (1000V~2000V). Insulation voltage: 150% rated voltage. | No breakdown or arcing. |
| Temperature Characteristics (Y5P) | Tested at specified temperatures | Capacitance change: 10% from -25 to +85 |
| Lead Tensile Strength | Axial tensile force of 10N applied for 101 seconds | No damage, breakage, or loosening of leads. |
| Bending Test | 5N weight suspended, body tilted 90, then restored. Repeated twice in opposite directions. | No lead damage. |
| Solderability | Solder temperature: 2355, Immersion time: 2.50.5 seconds | 95% coverage of immersed lead portion. |
| Vibration Test | Frequency range: 10~55Hz, Amplitude: 1.5mm, Time: 6 hours (2 hours per direction) | No visible damage, capacitance change within tolerance. |
| Resistance to Soldering Heat | Solder temperature: 2605, Immersion time: 100.5 Sec. | Capacitance change: 5% (Y5P). No visible damage. |
| Solubility Resistance | Immersion in Isopropyl alcohol for 305 seconds | No visible damage. |
| Temperature Cycling | 5 cycles of -25 to +85 with dwell times | Capacitance change: 10% (Y5P). No visible damage. |
| Damp Heat Test | 402, 90~95% RH for 500+24 hours | Capacitance change: See 5.3.5. Insulation Resistance: 1000M min. (Class ). No visible damage. |
| Endurance Test | 853 with 200% rated voltage for 1000+48 hours | Capacitance change within tolerance. No visible damage. |
| Testing Item | Limited Level |
|---|---|
| Cadmium (Cd)/Cadmium Compounds | 100 PPM |
| Lead (Pb)/Lead Compounds | 1000 PPM |
| Mercury (Hg)/Mercury Compounds | 1000 PPM |
| Hexavalent-Chromium (Cr6+) Compounds | 1000 PPM |
| PBB/PBDE | 1000 PPM |
| No. | Name | Specification | Supplier | Remarks |
|---|---|---|---|---|
| 1 | Lead wire | 0.55/0.6/0.70.05 | Shenzhen Yangqi Industrial Co., Ltd.; Ma'anshan Xingguan Electronic Materials Co., Ltd./Hengtai Electronics | |
| 2 | Ceramic Dielectric | Characteristic SLY5P, Y5U, Y5V | Guangdong Dafu Electronics Co., Ltd.; Kunshan Wanfeng Electronics Co., Ltd.; Hangzhou Xin'anjiang Tonghao Electronics Co., Ltd. | |
| 3 | Encapsulation Material | Epoxy Resin XCP-231; Epoxy Resin TK1000 | Xi'an Baker Electronic Materials Technology Co., Ltd.; Weihua Electronics | |
| 4 | Tin | Alloy Tin Bar Sn98Ag2.0 | Nanjing Damai Technology Industrial Co., Ltd. |
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Durable ceramic capacitor NDF H102K050BN48230L502 designed for power circuits and electronic devices Images |