| Visual | No abnormal exterior appearance | Visual inspection |
| Dimension | See Page 3 | Visual inspection |
| Insulation Resistance | 10,000M or 500/C (whichever is smaller) | V500V, Rated Voltage; V500V, Applied 500Vdc; Charge Time: 60sec. |
| Capacitance | Within The Specified Tolerance | Class NPO/SL; Class |
| Tan | Class NPO/SL: More Than 30pF: Q 1000; 30pF & Below: Q 400; Class X7R: 2.5%; Z5U/Y5U: 4.0% | Q Class : +20C (C : Capacitance, pF); Char. Maximum X7R: 2.5%; Tan Class : Z5U/Y5U: 4.0% |
| Withstanding Voltage | No dielectric breakdown or mechanical breakdown | Temp. Range: NPO -55~+125, SL -30~+85, X7R -55~+125, Y5U -30~+85, Z5U +10~+85; V500V: 200% Rated Voltage; 500VV1000V: 150% Rated Voltage; 1000V: 120% Rated Voltage for 1~5 sec. |
| Temperature Capacitance Coefficient | Class : NPO 30 ppm/, SL +350~-1000ppm; Class : X7R 15%, Y5U +22%~-56%, Z5U +22%~-56% | Class : [C2-C1/C1(T2-T1)] 100%; Class : (C2-C1)/C1 100%; T1: 25; T2: Test temperature; C1: Capacitance at 25; C2: Capacitance at T2 |
| Adhesive Strength of Termination | No indication of peeling, no mechanical damage | A 5Nf (0.5Kgf) pull force for 101 sec. |
| Resistance to Flexure of Substrate | Capacitance Change: NPO/SL 5.0%, X7R 12.5%, Y5U/Z5U 30.0% | Bending applied to 1.0 mm at 1.0 mm/sec. |
| Solderability | More than 90% of terminal surface newly soldered, no metal part comes out or dissolves, no mechanical damage | Solder Temp: 2455; Dip Time: 50.5 sec; Immersing Speed: 2510% mm/s; Solder: H63A; Flux: Rosin; Preheat: 80~120 for 10~30sec. |
| Resistance To Soldering Heat | Capacitance Change: Class (NPO/SL) Within 2.5% or 0.25pF (whichever is larger); X7R Within 10%; Class Z5U/Y5U Within 20%. Other specs to satisfy initial values. | Preheat: 15010 for 60~120sec; Dip: Solder Temp 2605; Dip Time: 101sec; Immersing Speed: 2510% mm/s; Solder: H63A; Flux: Rosin. Measure after cooling. |
| Temperature Cycle | Capacitance Change: Class (NPO/SL) Within 5.0% or 0.5pF (whichever is larger); X7R Within 15%; Class Z5U/Y5U Within 30%. Other specs to satisfy initial values. | Subject to five cycles of specified temperature steps. Solder on P.C. board before testing. Measure after cooling. |
| Humidity | Capacitance Change: Class (NPO/SL) Within 3.0% or 0.3pF (whichever is larger); X7R Within 15%; Class Z5U/Y5U Within 30%. Other specs to satisfy initial values. | Temp: 402; Relative Humidity: 90~95%RH; Test Time: 500+12/-0Hr. Solder on P.C. board before testing. Measure after cooling. |
| High Temperature Load (Life Test) | Capacitance Change: Class (NPO/SL) Within 2.5% or 0.25pF (whichever is larger); X7R Within 7.5%; Class Z5U/Y5U Within 20%. Other specs to satisfy initial values. | Applied DC voltage (following table) at max operation temp 3 for 1hr, then set for 484 hrs at room temp. Test Time: 1000+12/-0Hr. Measure after cooling. |
| Vibration | Insulation Resistance: To satisfy the specified initial value. | Solder on P.C. Board before testing. Vibrate with amplitude of 1.5mm P-P from 10Hz to 55Hz and back to 10Hz in ~1 min. Repeat for 2 hours each in 3 perpendicular directions. |
